Capabilities
Manufacturing Capabilities & Information
Services Include:
Quickturn prototyping, pre-production, and low to high volume production assembly. Consignment and Turnkey material procurement. Functional, in-circuit testing, and manufacturability recommendations. Board rework, repair, upgrade service and conformal coating.
Lead Time to Ship:
Prototypes 1-2 days after receipt of material. Pre-production 1 week plus longest material lead time. Production 3 weeks plus longest material lead time.
Manufacturing and Quality Standards:
IPC A-610 Class II and Class III, Workmanship Standards. Utilizing continuous quality improvement. Working toward ISO compliance.
EPA:Meet all requirements. Closed-Loop, Aqueous Cleaning Process with zero discharge. No clean soldering process (w/ customer approval).
ITAR Registered
Technical Information
Technical Capability:
Ability to accomplish very complex fine pitch assembly on a quick turn basis.
Test:
In house in-circuit and functional testing capability.
Applications:
A variety of applications such as memory boards, controllers, processor boards, consumer electronics.
Automation:
Placement equipment capable of handling part sizes from 0201 to largest pin PLCC.
AOI Inspection
Selective Solder System
BGA and Fine Pitch Capabilities:
Advanced Device Placement of 1.0mm BGA's and 0.8mm microBGA's. Currently to 12 mil centers for prototypes, and 19 mil centers (i.e. QFP's) for production. In-house real time X-ray inspection is available.
Equipment:
Click here to request the complete MPL equipment list or inquire about our capabilities.